Investigation the role of diuron as a curing agent in epoxy/DICY prepreg
Volume Title: 1
1Polymer Engineering Group, Composite Research Institute, Malek Ashtar University of Technology, Tehran, Iran
2Polymer Engineering Group, Composite Research Institute, Malek-Ashtar University of Technology
3Polymer engineering Group, Faculty of Materials and Manufacturing technologies, Malek-E-Ashtar University of Technology, Tehran, P.O.Box 15875-1774
In the epoxy prepreg manufacturing industry, Dicyandiamide (DICY) is a well-known latent curing agent with a curing temperature of 200 °C which necessarily uses accelerators like diuron to reduce the curing reaction temperature. The aim of this study was to investigate the curing mechanisms of the epoxy-DICY and epoxy-diuron curing systems in order to obtain the optimum composition of this formulation. using IR and DSC techniques to investigate the curing mechanisms and to obtain the optimum amount of DICY were used to complete the curing reaction. Result of experiments showed that diurane performed part of the curing reaction in addition to acceleration. It was observed that the epoxy-DICY curing reaction does not follow the stoichiometric ratio.