Improving Thermal Resistance of a Commercial Silicon Resin through Distribution of Hollow Silica Nanospheres
1Institute of Nano Science and Nano Technology, University of Kashan, Kashan 8731753153, Iran
2Department of Chemical Engineering, Faculty of Engineering, University of Kashan, Kashan 8731753153, Iran
3Research and Development Group, Exir Novin Farayand Asia Company, Tehran 1389714361, Iran
In this study, Hollow Silica Nanospheres (HSNS) is fabricated for improving thermal properties of a commercial silicon resin. Sample of HSNS powder with ratios of 10wt% and 30wt% is spread through a commercial silicon resin (SILIKOPHEN○ P80/X) by using ultrasound radiation. Hence, a template-assisted wet chemical method was used to prepare HSNS. Creation of hollow Silica Nanospheres in the range of 20-50 nm was proved by TEM analysis. Besides, Thermal properties of silicon resin containing HSNS investigated with thermogravimetric analysis (TGA). By increasing amount of HSNS up to 30 wt. % the temperature of first stage of degradation increased from 365 to 400 °C while the second one improved from 465 to 490 °C. The residual value in TGA analysis at 600 °C for pure silicon resin, silicon resin of 10wt% and 30 wt. % HSNS were 43.04%, 47.82% and 73.83%, respectively. Improving thermal resistance of commercial silicon resin were observed by adding ceramic Silica Nanospheres. In fact, by adding HSNS to silicon resin, degradation of silicon resin decreased.